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Successful SWIFT demonstration showcases Lockheed Martin and Altera collaboration with OUSD (R&E), highlighting the future of electronic warfare and microelectronics

Global Military Communications
Successful SWIFT demonstration showcases Lockheed Martin and Altera collaboration with OUSD (R&E), highlighting the future of electronic warfare and microelectronics

Lockheed Martin in collaboration with Altera, an Intel Company, has completed a successful flight demonstration of our 12th Generation Electronic Warfare (Gen12) transceiver utilizing Altera’s Agilex™ 9 Direct RF FPGA (Multi-Chip Package, MCP-2).


The project, coined SWIFT (SHIP-enabled Wideband Transceiver Integrated Flight Test) by the Office of the Under Secretary of Defense for Research and Engineering (OUSD-R&E), established an aggressive requirement for Lockheed Martin to perform an electronic warfare flight demonstration utilizing Altera’s FPGA aboard a Group 2 Unmanned Air Vehicle (UAV) in less than 12 months.


Conducted at the US Army’s Yuma Proving Ground, the SWIFT demonstration represented the first time Lockheed Martin used the Altera Direct RF FPGA in a government test environment, showcasing the device’s readiness to perform real-world missions. The event successfully proved the Gen12’s Electronic Support (ES) capability by performing the detect, identify and locate mission against real enemy emitters in a DoD relevant environment.


Through the success of this demonstration, Lockheed Martin and Altera proved how size, weight and power (SWaP) constrained airborne platforms can be utilized to deliver electronic warfare effects, while also allowing growth for new capabilities. The technology enables a low SWaP, Sensor Open System Architecture (SOSA) aligned digital transceiver that performs the Electronic Support (ES) and Electronic Attack (EA) missions using domestically produced semiconductors.


This demonstration serves as a proof point for the importance of OUSD-R&E State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program and the ongoing need for sustainable US-made microelectronics packages customized for DoD applications.

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