MACOM Technology Solutions Inc., a leading supplier of semiconductor solutions, will showcase its optoelectronic and photonic components at the China International Optoelectronic Exposition (CIOE) 2019 in Shenzhen, China, September 4th – 7th, Booth #1A32. CIOE is the world’s leading exhibition in the optoelectronic and photonic industry.
Meet with MACOM and learn how our broad portfolio of components is enabling high bandwidth and low latency, addressing the high-performance analog interfaces between electrical and optical domains, and providing solutions aimed at meeting the demanding size, power and signal integrity requirements of today’s high-speed next-generation PON, Wireless and Wireline Telecom and Cloud Data Center networks.
Our complete and robust portfolio includes high-performance modulator drivers, transimpedance amplifiers (TIAs), clock/data recovery circuits (CDR), crosspoint switches, APDs, pin photodiodes, FP and DFB lasers, mixed signal PHYs and PAM-4 for enterprise and telecom optical systems operating up to 100/200/400 Gbps and beyond.
Join the Next Generation with MACOM at Booth #1A32 to learn more about:
PON Components: 10/25 Gbps-PON ONU/OLT
Telecom Portfolio: 25Gbps CDR, TIA and driver portfolios, 25Gbps FP lasers, APD photodiodes and 50 Gbps PAM-4 chipset
Data Center Components: 100 Gbps CWDM4, DR1/FR1/LR1 and 100/200/400 Gbps PAM-4
Long-Haul and Metro Components: 64 GBaud driver and TIA